This video shows the unique mask repair stenciling system designing to make the repair of solder mask in large or repeatable areas much faster and more consistent. Simply peel back the stencil from the backing material, align it to the board and place in to position. Use liquid solder mask (UV curable in a small vial cab be purchased here) to pur some on to the stencil and using a micro squeegee roll the mask material in to the apertures of the stencil. Cure the mask and peel off the stencil thereby exposing the repaired solder mask in select areas.

Stencil Thickness: 0.014in (.045mm),
Minimum Aperture Size: .002in (.05mm)
Stencil Material: .Plastic film with release liner. Adhesive is a low tack sticky note type of adhesive.
MinimumPitch: .020in (0.5mm)
Maximum Area: Approx 4 x 4in (100mm x 100mm)
For more information visit on www.soldertools.net